The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Christoffel conformal mapping-finite difference procedure and the hybrid FEM/DBCI method. Different structures can be analyzed containing single or multiple ground planes, with finite or infinite thickness, with or without pads. Comparisons are made with other methods, showing that a greater accuracy is obtained by means of the two methods proposed.
Computing capacitances of vias in multilayered boards
FANNI, ALESSANDRA
2001-01-01
Abstract
The capacitances of multilayered board vias are calculated by means of two methods: the Schwarz-Christoffel conformal mapping-finite difference procedure and the hybrid FEM/DBCI method. Different structures can be analyzed containing single or multiple ground planes, with finite or infinite thickness, with or without pads. Comparisons are made with other methods, showing that a greater accuracy is obtained by means of the two methods proposed.
File in questo prodotto:
Non ci sono file associati a questo prodotto.
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
