Electrochemical deposition of Cu and Nb from pyrrolidinium based ionic liquid

A study on the electrochemical deposition of Cu/Nb composites is presented in this work. The electrodeposition tests were performed using 1-butyl-1-methylpyrrolidinium bis (trifluoromethylsulphonyl) imide as solvent. The electrochemical behaviour of copper and niobium ions was investigated by cyclic and linear sweep voltammetries, allowing to obtain information on potentials and mechanisms of deposition. Firstly, the electrodeposition of Nb on Cu substrate and of Cu on Nb substrate was investigated; then, the deposition of Cu and Nb in dual bath mode was considered. All the experimental tests were carried out at 125 °C under inert atmosphere, in order to avoid interference of water and oxygen. According to the electrochemistry of the metals considered and based on the experimental results, the possible reaction path for the oxidation/reduction was proposed. Deposition tests were carried out at different potentials and the related samples were analysed by scanning electron microscopy and energy dispersive X-ray spectroscopy. Structural and chemical analyses indicate that the obtained deposits cover uniformly the electrode surface and exhibit individual layers with a characteristic size ranging between 50 and 100 nm.