A series of idealized collisions between a Cu crystal with a surface asperity and a Sn one with a flat surface have been studied by atomistic simulations. The crystals were first brought into contact, then submitted to relative sliding for selected lengths, and finally separated. Material transfer from the Sn crystal to the Cu one takes place, in amounts depending on sliding length and temperature. Size and temperature govern the possible melting of the transferred Sn domains. When this occurs, Cu atoms dissolve into molten Sn, finally forming a chemically disordered solid solution.
A possible alloying mechanism in idealized collisions between Cu and Sn crystals
DELOGU, FRANCESCO
2012-01-01
Abstract
A series of idealized collisions between a Cu crystal with a surface asperity and a Sn one with a flat surface have been studied by atomistic simulations. The crystals were first brought into contact, then submitted to relative sliding for selected lengths, and finally separated. Material transfer from the Sn crystal to the Cu one takes place, in amounts depending on sliding length and temperature. Size and temperature govern the possible melting of the transferred Sn domains. When this occurs, Cu atoms dissolve into molten Sn, finally forming a chemically disordered solid solution.
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