Adapting electronics to perfectly conform to nonplanar and rough surfaces, such as human skin, is a challenging task, which could open up new applications in fields of high economic and scientific interest, ranging from health to robotics, human-machine interface, and Internet of Things. The key to success lies in defining a technology that can lead to ultrathin devices, exploiting ultimately thin materials, with high mechanical flexibility and excellent electrical properties. Here, we report a hybrid approach for the development of high-performance, ultrathin and conformable electronic devices, based on the integration of semiconducting transition metal dichalcogenides, i.e., MoS2, with organic gate dielectric material, i.e., polyvinyl formal (PVF) combined with inkjet printed PEDOT:PSS electrodes. Through this novel approach, transistors and simple digital and analogue circuits are fabricated by a sequential stacking of ultrathin (nanometer) layers on a few micrometers thick polyimide substrate, which guarantees the high flexibility mandatory for the targeted applications.

Ultrathin Transistors and Circuits for Conformable Electronics

Viola F. A.;
2024-01-01

Abstract

Adapting electronics to perfectly conform to nonplanar and rough surfaces, such as human skin, is a challenging task, which could open up new applications in fields of high economic and scientific interest, ranging from health to robotics, human-machine interface, and Internet of Things. The key to success lies in defining a technology that can lead to ultrathin devices, exploiting ultimately thin materials, with high mechanical flexibility and excellent electrical properties. Here, we report a hybrid approach for the development of high-performance, ultrathin and conformable electronic devices, based on the integration of semiconducting transition metal dichalcogenides, i.e., MoS2, with organic gate dielectric material, i.e., polyvinyl formal (PVF) combined with inkjet printed PEDOT:PSS electrodes. Through this novel approach, transistors and simple digital and analogue circuits are fabricated by a sequential stacking of ultrathin (nanometer) layers on a few micrometers thick polyimide substrate, which guarantees the high flexibility mandatory for the targeted applications.
2024
2D semiconductor; conformable electronics; organic dielectric; printable contacts; ultrathin FETs
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11584/428023
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