Adapting electronics to perfectly conform to nonplanar and rough surfaces, such as human skin, is a challenging task, which could open up new applications in fields of high economic and scientific interest, ranging from health to robotics, human-machine interface, and Internet of Things. The key to success lies in defining a technology that can lead to ultrathin devices, exploiting ultimately thin materials, with high mechanical flexibility and excellent electrical properties. Here, we report a hybrid approach for the development of high-performance, ultrathin and conformable electronic devices, based on the integration of semiconducting transition metal dichalcogenides, i.e., MoS2, with organic gate dielectric material, i.e., polyvinyl formal (PVF) combined with inkjet printed PEDOT:PSS electrodes. Through this novel approach, transistors and simple digital and analogue circuits are fabricated by a sequential stacking of ultrathin (nanometer) layers on a few micrometers thick polyimide substrate, which guarantees the high flexibility mandatory for the targeted applications.
Ultrathin Transistors and Circuits for Conformable Electronics
Viola F. A.;
2024-01-01
Abstract
Adapting electronics to perfectly conform to nonplanar and rough surfaces, such as human skin, is a challenging task, which could open up new applications in fields of high economic and scientific interest, ranging from health to robotics, human-machine interface, and Internet of Things. The key to success lies in defining a technology that can lead to ultrathin devices, exploiting ultimately thin materials, with high mechanical flexibility and excellent electrical properties. Here, we report a hybrid approach for the development of high-performance, ultrathin and conformable electronic devices, based on the integration of semiconducting transition metal dichalcogenides, i.e., MoS2, with organic gate dielectric material, i.e., polyvinyl formal (PVF) combined with inkjet printed PEDOT:PSS electrodes. Through this novel approach, transistors and simple digital and analogue circuits are fabricated by a sequential stacking of ultrathin (nanometer) layers on a few micrometers thick polyimide substrate, which guarantees the high flexibility mandatory for the targeted applications.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.