Characterizing the degradation of organic electronics is fundamental for the exploitation of this technology in different scenarios, including aerospace and biomedical applications. In this paper, flexible printed organic transistors were exposed to controlled environmental conditions that may resemble those for the above-mentioned applications, including thermal and radiation stresses. The effect of encapsulation layers in enhancing the device reliability is discussed.
Evaluation of flexible organic transistor stability in harsh conditions
Casula G.;Ricci P. C.;Mura G.;Lai S.
2024-01-01
Abstract
Characterizing the degradation of organic electronics is fundamental for the exploitation of this technology in different scenarios, including aerospace and biomedical applications. In this paper, flexible printed organic transistors were exposed to controlled environmental conditions that may resemble those for the above-mentioned applications, including thermal and radiation stresses. The effect of encapsulation layers in enhancing the device reliability is discussed.
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